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Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Electrical Through-Wafer Interconnects

Permanent Link: http://ufdc.ufl.edu/UFE0003340/00001

Material Information

Title: Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Electrical Through-Wafer Interconnects
Physical Description: Mixed Material
Copyright Date: 2008

Record Information

Source Institution: University of Florida
Holding Location: University of Florida
Rights Management: All rights reserved by the source institution and holding location.
System ID: UFE0003340:00001

Permanent Link: http://ufdc.ufl.edu/UFE0003340/00001

Material Information

Title: Thermoelastically Actuated Acoustic Proximity Sensor with Integrated Electrical Through-Wafer Interconnects
Physical Description: Mixed Material
Copyright Date: 2008

Record Information

Source Institution: University of Florida
Holding Location: University of Florida
Rights Management: All rights reserved by the source institution and holding location.
System ID: UFE0003340:00001